Shipping Estimate
USA
- USA
- CAN
- USA
- CAN
Ships within 48 hours · Estimated delivery Jul 11 - Jul 16
Promo Codes Available:
For Your Every Summer RSVP, with Code: SUMMER15
Description
BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9Made by high quality metal material Easy and quickly for reballing the BGA IC Excellent to replace IC or BGA rework reballing Compatible with Universal Models Universal Package included 1 x BST iPH 2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S 6SP A9 Specifications Brand N A Color As Shown Condition OEM Logo Without Logo Parts Type Others Gross Weight 0. 011kg Volume Weight 0. 009kg Package Length 10. 000cm Package Width 8. 000cm
Made by high quality metal material
Easy and quickly for reballing the BGA IC
Excellent to replace IC or BGA rework reballing
Compatible with
- Universal Models
- Universal
Package included
- 1 x BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9
Specifications
| Brand | N/A |
| Color | As Shown |
| Condition | OEM |
| Logo | Without Logo |
| Parts Type | Others |
| Gross Weight | 0.011kg |
| Volume Weight | 0.009kg |
| Package Length | 10.000cm |
| Package Width | 8.000cm |
| Package Height | 0.500cm |
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.
Exchange/Return Notes
- We offer a 30-day return/exchange service after receiving.
- Final sale items are not eligible for returns or exchanges.
- To process your return/exchange, please contact us at [email protected]
- Please click here for more details>>> Return & Exchange Policy